This is another method of leaving the
individual circuits in a mother panel format. Scoring machines tend to
either work by edge or pin location. Ours is the latter and uses a pair
of pins for its registration.
A V shaped groove is cut top and bottom which
then allows the circuits to be broken out of there panel. A small amount
of the outer edges of the boards is removed in the process, which would
include any fine track running along the edge.
Another point of warning is that the flexing
during the breaking of the panel can lead to failures with surface mount
components. This process is not recommended for that type of board
unless you use one of the special machines to break the boards out
Although any normal laminate can be used the
CEM or FR2/paper laminates are preferable to epoxy FR4. Main reasons are
a cleaner final edge and reduced component damage resulting from the
lower forces required to separate the panels.
For large batches of small PCBs this scoring if
regularly the most cost effective profiling option.